Provision ISR PTG-01 Spécifications télécharger pdf (Page 159)

 2002 Microchip Technology Inc. DS30325B-page 157

PIC16F7X

28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF) (Continued)

Pad Width

*Controlling Parameter

Drawing No. C04-2114

B .009.011.0140.230.280.35

Pitch

MAX

Units

Dimension Limits

INCHES

.026 BSC

MIN NOM MAX

MILLIMETERS*

MIN

0.65 BSC

NOM

Pad Length

Pad to Solder Mask

L .020 .024 .030 0.50 0.60 0.75

M.005 .0060.13 0.15

M B

PACKAGE

EDGE

SOLDER

MASK

1 2 ... 154 155 156 157 158 159 160 161 162 163 164 ... 173 174

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Provision ISR PTG-01 Spécifications Page 159